Sputtering is one of the most common and widely used technologies for thin film manufacturing. Target materials are available in a variety of grades and purities to meet specific customer requirements.
| Grade | 3N, 3N5, 4N, with Ta 99.99%min |
| Recrystallization | 95%min |
| Grain size | ASTM 4 or finer |
| Surface finish | 16Rms max. or Ra 0.4 ( RMS64 or better) |
| Flatness | 0.1mm or 0.15% max |
| Tolerance | +/-0.010" on all dimensions |
News 16. 04. 24:
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Titanex' stocklists (Ti)
